Production Process of Liquid Crystal Modules

Release time:

2025-11-25

Surface mount technology (SMT) is a more traditional mounting method. Its advantages include high reliability, while its disadvantages are bulkiness, high cost, and limitations on LCM miniaturisation. 　　

COB

Chip On Board

Refers to the bonding of chips directly onto the PCB. As IC manufacturers are reducing production of QFP (a type of SMT) packaging for LCD control and related chips, traditional SMT methods will be progressively replaced in future products. 　　

TAB

Tape Automated Bonding. Utilises anisotropic conductive adhesive bonding. ICs packaged as TCP (Tape Carrier Package) are individually secured to the LCD and PCB using anisotropic conductive adhesive. This mounting method reduces LCM weight and volume, offers ease of installation, and provides good reliability. 　　

COG

COG LCD Module (Chip On Glass)

The chip is directly bonded onto glass. This mounting method significantly reduces the overall volume of the LCD module and facilitates mass production. It is suitable for LCDs in consumer electronics such as mobile phones, PDAs, and other portable devices. Driven by IC manufacturers, this mounting method is poised to become the primary connection approach for ICs and LCDs in the future. 　　

COF

Chip On Film

The chip is directly mounted onto a flexible PCB. This connection method offers high integration, allowing peripheral components to be mounted alongside the IC on the flexible PCB. It represents an emerging technology currently in the trial production phase.

Securing the dominant position in the large-to-medium size LCD market

High quality at low cost remains the long-term objective LCD modules forge ahead against adversity